JPH0745992Y2 - 電子部品とシールドケースとの接地構造 - Google Patents
電子部品とシールドケースとの接地構造Info
- Publication number
- JPH0745992Y2 JPH0745992Y2 JP4312690U JP4312690U JPH0745992Y2 JP H0745992 Y2 JPH0745992 Y2 JP H0745992Y2 JP 4312690 U JP4312690 U JP 4312690U JP 4312690 U JP4312690 U JP 4312690U JP H0745992 Y2 JPH0745992 Y2 JP H0745992Y2
- Authority
- JP
- Japan
- Prior art keywords
- shield case
- electronic component
- package
- substrate
- grounding structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Multi-Conductor Connections (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4312690U JPH0745992Y2 (ja) | 1990-04-20 | 1990-04-20 | 電子部品とシールドケースとの接地構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4312690U JPH0745992Y2 (ja) | 1990-04-20 | 1990-04-20 | 電子部品とシールドケースとの接地構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH042097U JPH042097U (en]) | 1992-01-09 |
JPH0745992Y2 true JPH0745992Y2 (ja) | 1995-10-18 |
Family
ID=31555278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4312690U Expired - Lifetime JPH0745992Y2 (ja) | 1990-04-20 | 1990-04-20 | 電子部品とシールドケースとの接地構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0745992Y2 (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010219218A (ja) * | 2009-03-16 | 2010-09-30 | Alps Electric Co Ltd | 電子回路ユニット |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52116581A (en) * | 1976-03-25 | 1977-09-30 | Nippon Steel Corp | Particle conveyor |
CN116230694A (zh) * | 2021-12-06 | 2023-06-06 | 华为技术有限公司 | 一种芯片系统及通信设备 |
-
1990
- 1990-04-20 JP JP4312690U patent/JPH0745992Y2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010219218A (ja) * | 2009-03-16 | 2010-09-30 | Alps Electric Co Ltd | 電子回路ユニット |
Also Published As
Publication number | Publication date |
---|---|
JPH042097U (en]) | 1992-01-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0223024Y2 (en]) | ||
US5030800A (en) | Printed wiring board with an electronic wave shielding layer | |
US5777277A (en) | Printed circuit board | |
EP0489118A1 (en) | MULTI-LAYERED CIRCUIT BOARD ELIMINATING RADIO-ELECTRIC INTERFERENCE OF HF SIGNALS. | |
JPH0412714Y2 (en]) | ||
JP3228841B2 (ja) | シールド装置 | |
US5657208A (en) | Surface mount attachments of daughterboards to motherboards | |
US6020562A (en) | Reduced-capacitance component mounting pads and capacitance-reduction methods for high frequency multi-layer printed circuit boards | |
JPH0745992Y2 (ja) | 電子部品とシールドケースとの接地構造 | |
JP3082579B2 (ja) | シールドケース | |
JP2785502B2 (ja) | プリント基板 | |
JPS5843803Y2 (ja) | プリント配線基板の支持装置 | |
JP3104109B2 (ja) | 電子回路モジュール装置 | |
EP0674476A2 (en) | Shielding device | |
JPH05283888A (ja) | プリント配線板およびその製造方法 | |
JP2715957B2 (ja) | 混成集積回路装置 | |
JPH04365396A (ja) | 高周波用面実装モジュール | |
JPS635220Y2 (en]) | ||
JPH0553269U (ja) | 高周波シールド構造を有する多層配線基板 | |
JPH0548231A (ja) | 密度の異なる回路基板の実装構造 | |
JPS60143618A (ja) | 電子部品 | |
JP3221130B2 (ja) | 取付部材の基板に対する接合構造および電子部品 | |
JPH0992523A (ja) | プリント回路パターン | |
JP2000106475A (ja) | 回路基板装置 | |
JPS63187691A (ja) | プリント配線板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |